Ultra-Fast Picosecond Laser Source: Equipped with a high-power picosecond laser system, it minimizes the heat-affected zone (HAZ) and eliminates micro-cracks, chipping, and edge defects.
Non-Contact Processing: No mechanical stress or tool wear, ensuring pristine surface quality and dimensional accuracy for fragile optical substrates.
High Precision & Versatility: Supports cutting of complex geometries, irregular shapes, and ultra-thin glass (down to 0.1 mm) with positioning accuracy ≤ ±0.1 mm.
Wide Material Compatibility: Processes optical glass (BK7, fused silica, borosilicate), quartz, and coated optical components with consistent performance.
Advanced Control System: Integrated CCD vision positioning and CNC control for automated, programmable cutting paths and high repeatability.
Enhanced Cutting Quality: Produces smooth, vertical edges with minimal edge chipping (<10 μm), significantly reducing post-processing grinding and polishing requirements.
Increased Production Efficiency: Cutting speeds up to 600 mm/s, several times faster than conventional CNC machining, boosting overall throughput.
Expanded Capabilities: Enables fabrication of high-precision, custom-shaped optical elements that were previously difficult or impossible to produce with mechanical methods.
Cost Reduction: Lower tooling costs, reduced material waste, and fewer secondary processes lead to improved manufacturing economics.
High-precision optical lenses and prisms
Laser system components
Medical device optics
Industrial imaging and machine vision elements
Custom optical glass substrates